Daydream and Dynovel will participate at the 2024 World of Packaging from 18-20 November 2024 in Shanghai
Lina Zuo, lina.zuo@daydream.eu, will attend the fair and looks forward [...]
Daydream and Dynovel will participate at Material Week from 29-31 October 2024 in Tokyo
Wei Shen, wei.shen@daydream.eu, will attend the fair and looks forward [...]
Daydream is excited to announce its participation in CPHI taking place from October 8-10, 2024, at Fiera Milano, Milan, Italy
Serena Gippa (serena.gippa@daydream.eu) will attend the fair and looks forward [...]